Title :
Single-chip CMOS anemometer
Author :
Mayer, F. ; Haberli, A. ; Jacobs, H. ; Ofner, G. ; Paul, O. ; Baltes, H.
Author_Institution :
Phys. Electron. Lab., Eidgenossische Tech. Hochschule, Zurich, Switzerland
Abstract :
For the first time a packaged single-chip anemometry microsystem is reported. The system includes a thermal CMOS flow sensor with on-chip power management, signal conditioning, and A/D conversion. It is fabricated using an industrial IC process followed by post-CMOS micromachining. The system is packaged on a flexible substrate using flip-chip interconnection technology. The measurement of wind speeds is demonstrated in the range from 0 to 38 m/s (0 to 12 Beaufort), with a dynamic range of 65 dB. Total power consumption is 3 mW.
Keywords :
CMOS integrated circuits; anemometers; electric sensing devices; flip-chip devices; integrated circuit packaging; membranes; micromachining; microsensors; thermoelectric devices; thermopiles; 0 to 38 m/s; 3 mW; A/D conversion; ADC; flexible substrate; flip-chip interconnection technology; industrial IC process; onchip power management; packaged microsystem; post-CMOS micromachining; signal conditioning; single-chip CMOS anemometer; thermal CMOS flow sensor; thermoelectric microsensor; wind speed measurement; Energy management; Fluid flow measurement; Micromachining; Packaging; Power system management; Sensor systems; System-on-a-chip; Textile industry; Thermal management; Thermal sensors;
Conference_Titel :
Electron Devices Meeting, 1997. IEDM '97. Technical Digest., International
Conference_Location :
Washington, DC, USA
Print_ISBN :
0-7803-4100-7
DOI :
10.1109/IEDM.1997.650525
