Single-chip CMOS anemometer

Author

Mayer, F. ; Haberli, A. ; Jacobs, H. ; Ofner, G. ; Paul, O. ; Baltes, H.

Author_Institution

Phys. Electron. Lab., Eidgenossische Tech. Hochschule, Zurich, Switzerland

fYear

1997

fDate

10-10 Dec. 1997

Firstpage

895

Lastpage

898

Abstract

For the first time a packaged single-chip anemometry microsystem is reported. The system includes a thermal CMOS flow sensor with on-chip power management, signal conditioning, and A/D conversion. It is fabricated using an industrial IC process followed by post-CMOS micromachining. The system is packaged on a flexible substrate using flip-chip interconnection technology. The measurement of wind speeds is demonstrated in the range from 0 to 38 m/s (0 to 12 Beaufort), with a dynamic range of 65 dB. Total power consumption is 3 mW.

Keywords

CMOS integrated circuits; anemometers; electric sensing devices; flip-chip devices; integrated circuit packaging; membranes; micromachining; microsensors; thermoelectric devices; thermopiles; 0 to 38 m/s; 3 mW; A/D conversion; ADC; flexible substrate; flip-chip interconnection technology; industrial IC process; onchip power management; packaged microsystem; post-CMOS micromachining; signal conditioning; single-chip CMOS anemometer; thermal CMOS flow sensor; thermoelectric microsensor; wind speed measurement; Energy management; Fluid flow measurement; Micromachining; Packaging; Power system management; Sensor systems; System-on-a-chip; Textile industry; Thermal management; Thermal sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Electron Devices Meeting, 1997. IEDM '97. Technical Digest., International

Conference_Location

Washington, DC, USA

ISSN

0163-1918

Print_ISBN

0-7803-4100-7

Type

conf

DOI

10.1109/IEDM.1997.650525

Filename

650525