Design of integrated thin film coolers

Author

LaBounty, Chris ; Shakouri, Ali ; Robinson, Gerry ; Abraham, Patrick ; Bowers, John E.

Author_Institution

Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA

fYear

1999

fDate

Aug. 29 1999-Sept. 2 1999

Firstpage

23

Lastpage

26

Abstract

Thin film coolers can be monolithically integrated with optoelectronic and high-speed electronic components. Important parameters in the design of such coolers are investigated theoretically and experimentally. A three-dimensional finite element simulator (ANSYS) is used to model self consistently thermal and electrical properties of a complete device structure. Heat conduction, Joule heating, thermoelectric and thermionic cooling are included as well as non ideal effects such as contact resistance, finite thermal resistance of the substrate and the heat sink, and heat generation in the wire bonds. Various substrate materials (InP, Si, Cu, diamond) and thicknesses are studied as well as the effect of current spreading in different sample geometries. Comparisons to experimental results with InGaAsP-based thermionic coolers are made. Simulations demonstrate that single stage thin film coolers can provide up to 20-30 degrees centigrade cooling with cooling power densities of several 1000´s W/cm/sup 2/.

Keywords

contact resistance; cooling; digital simulation; finite element analysis; heat conduction; heat sinks; integrated optoelectronics; monolithic integrated circuits; substrates; thermal analysis; thermal management (packaging); thermal resistance; thermionic conversion; thermoelectric devices; thin film devices; 3D finite element simulator; ANSYS; C; Cu; InGaAsP; InP; Joule heating; Si; contact resistance; current spreading; electrical properties; heat conduction; heat sink thermal resistance; high-speed electronic components; integrated thin film coolers; modelling; monolithic integration; nonideal effects; optoelectronic components; single stage coolers; substate finite thermal resistance; substrate materials; substrate thicknesses; thermal properties; thermionic cooling; thermoelectric cooling; thin film cooler design; wire bond heat generation; Contact resistance; Electronics cooling; Finite element methods; Heat sinks; High-speed electronics; Substrates; Thermal conductivity; Thermal resistance; Thermoelectricity; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermoelectrics, 1999. Eighteenth International Conference on

Conference_Location

Baltimore, MD, USA

ISSN

1094-2734

Print_ISBN

0-7803-5451-6

Type

conf

DOI

10.1109/ICT.1999.843326

Filename

843326