DocumentCode
2006134
Title
Breakdown strength of solid|solid interface
Author
Hasheminezhad, Seyed Majid ; Ildstad, Erling ; Nysveen, Arne
Author_Institution
Dept. of Electr. Power Eng., Norwegian Univ. of Sci. & Technol., Trondheim, Norway
fYear
2010
fDate
4-9 July 2010
Firstpage
1
Lastpage
4
Abstract
Interfaces between solids are generally considered weak regions in electrical insulation systems. This is particularly so if the electrical stress is applied parallel to the interface. Important parameters, affecting the breakdown strength, are interface pressure, humidity, presence of liquid dielectric and the surface roughness of the solid in contact. The main aim of the work presented here is to examine, theoretically and experimentally, the effect of interfacial pressure and roughness on the tangential breakdown strength. The size and gas pressure of enclosed surface voids were estimated using mechanical contact theory. The dielectric 50 Hz AC tangential strength of XLPE|XLPE interface was investigated for various values of pressure and roughness. The increase in breakdown strength due to increased pressure was largest in case of surfaces with the high degree of roughness. As expected the highest breakdown strength was observed in case of the smoothest surfaces. The estimated results of void size and gas pressure were found to be in good agreement with the experimental observations.
Keywords
XLPE insulation; electric breakdown; mechanical contact; pressure; surface roughness; AC tangential strength; XLPE-XLPE interface; electrical insulation; frequency 50 Hz; interface pressure; mechanical contact theory; solid-solid interface; surface roughness; surface voids; tangential breakdown strength; Electric breakdown; Petroleum; Pressure measurement; Rough surfaces; Solids; Surface roughness; Surface topography;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid Dielectrics (ICSD), 2010 10th IEEE International Conference on
Conference_Location
Potsdam
Print_ISBN
978-1-4244-7945-0
Electronic_ISBN
978-1-4244-7943-6
Type
conf
DOI
10.1109/ICSD.2010.5568229
Filename
5568229
Link To Document