DocumentCode :
2006205
Title :
Enhancing the permittivity, thermal conductivity and mechanical strength of elastomer composites by using surface modified BaTiO3 nanoparticles
Author :
Huang, Xingyi ; Xie, Liyuan ; Jiang, Pingkai ; Fei Liu
Author_Institution :
Dept. of Polymer Sci. & Eng., Shanghai Jiao Tong Univ., Shanghai, China
fYear :
2010
fDate :
4-9 July 2010
Firstpage :
1
Lastpage :
4
Abstract :
The development of devices for electric stress control includes several significant challenges for polymer composite dielectrics, including the need for high permittivity, high mechanical strength, high thermal conductivity, good dielectric strength, and good ductility. However, the conventional methods to increase the permittivity of a polymer suffer from very low mechanical and dielectric strength. The present experimental investigation shows our results about the influence of the surface modified BaTiO3 nanoparticles on the permittivity, thermal conductivity and micromechanical properties of ethylene-vinyl acetate (EVM) vulcanizates. It was found that the incorporation of surface modified BaTiO3 nanoparticles into the EVM matrix increased the permittivity, thermal conductivity and the mechanical strength. In particular, the nanocomposites exhibit good dielectric strength and good ductility even at the loading level of 50 vol%.
Keywords :
barium compounds; composite materials; ductility; elastomers; electric strength; mechanical strength; nanoparticles; permittivity; stress analysis; thermal conductivity; BaTiO3; EVM matrix; ductility; elastomer composites; electric stress control; ethylene-vinyl acetate; mechanical strength; permittivity enhancement; polymer composite dielectrics; surface modified nanoparticles; thermal conductivity; Conductivity; Loading; Nanocomposites; Nanoparticles; Permittivity; Polymers; Thermal conductivity; BaTiO3 nanoparticles; elastomers; high permittivity; mechanical property; thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid Dielectrics (ICSD), 2010 10th IEEE International Conference on
Conference_Location :
Potsdam
Print_ISBN :
978-1-4244-7945-0
Electronic_ISBN :
978-1-4244-7943-6
Type :
conf
DOI :
10.1109/ICSD.2010.5568234
Filename :
5568234
Link To Document :
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