• DocumentCode
    2006227
  • Title

    Dielectric breakdown characteristics of alumina

  • Author

    Talbi, Fatiha ; Lalam, Fadila ; Malec, David

  • Author_Institution
    Quntium Chem. & Phys. Lab., Mouloud Mammeri Univ., Tizi-Ouzou, Algeria
  • fYear
    2010
  • fDate
    4-9 July 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The AC 50 Hz sine dielectric breakdown of alumina ceramics versus thickness (0.127 to 2.54 mm) and purity (92%, 96% and 99.5%) was investigated. The results have shown that the dielectric strength decreases with the thickness and increases with the purity. Furthermore, the investigation of the failure morphology using the scanning electron microscopy (SEM) show for each specimens submitted to breakdown the presence of a canal terminated by a crater at the surface. This crater is resulting from the extraction and ejection of the matter during the breakdown process caused by the intensification of the local electric stress. An evolution of the crater size versus the sample thickness have also been observed. The analysis of the experimental results and the SEM observations confirm that the built up of the crater is a crucial step in dielectric breakdown process and the mechanism best suited to describe the dielectric breakdown in these materials is based on an electromechanical one.
  • Keywords
    alumina; ceramics; electric breakdown; electric strength; scanning electron microscopy; SEM; alumina ceramics; dielectric breakdown characteristics; electromechanical; faillure morphology; frequency 50 Hz; local electric stress intensification; scaning electron microscopy; size 0.127 mm to 2.54 mm; Ceramics; Dielectric breakdown; Dielectrics; Electrodes; Surface morphology; alumina; crater; dielectric breakdown mechanism;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid Dielectrics (ICSD), 2010 10th IEEE International Conference on
  • Conference_Location
    Potsdam
  • Print_ISBN
    978-1-4244-7945-0
  • Electronic_ISBN
    978-1-4244-7943-6
  • Type

    conf

  • DOI
    10.1109/ICSD.2010.5568235
  • Filename
    5568235