DocumentCode :
2006349
Title :
Single Pole Hybrid Switch
Author :
Panda, Rajesh Kumar ; Veeramalla, Jitendar
Author_Institution :
SDDC, Larsen & Toubro Ltd., Powai, India
fYear :
2013
fDate :
22-25 Sept. 2013
Firstpage :
1
Lastpage :
6
Abstract :
Electromechanical switching device while making & breaking an electrical circuit is subjected to arcing which is responsible for faster contact wear out, burning of insulation and conductive tracking between the poles. This leads to premature failure and poor electrical life of the device. To avoid the above problem it has been a practice to use solid state switching device. However owing to its high voltage drop across the terminal is subjected to higher conduction loss and hence temperature which demands for higher size, volume and costly heat sink to regulate the temperature within its permissible limits. The present paper reveals about 32A, 240V single pole hybrid switch consisting of low thermal resistance anti-parallel SCR connected across electromechanical AgCdO contacts so that making & breaking current is shared by SCR & continuous load current by contacts. A direct copper, chip and terminal bonding with the Al2O3 or AlN substrate aids in higher thermal conductivity and heat dissipation of the SCR. Experiment result shows no arcing voltage in the voltage waveform during making & breaking of the load. After 1,77,000 number of electrical operation there is no presence of any pit marks, crater formation, carbon deposition or erosion of AgCdO contact material observed.
Keywords :
cadmium compounds; cooling; electrical contacts; heat sinks; silver compounds; switches; thermal conductivity; thyristors; AgCdO; carbon deposition; conduction loss; conductive tracking; contact material; contact wear; continuous load current; crater formation; current 32 A; electrical circuit; electromechanical contacts; electromechanical switching device; heat dissipation; heat sink; high voltage drop; insulation burning; low thermal resistance antiparallel SCR; single pole hybrid switch; solid state switching device; terminal bonding; thermal conductivity; voltage 240 V; voltage waveform; Contacts; Force; Integrated circuit modeling; Resistance; Solids; Switches; Thyristors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Holm Conference on Electrical Contacts (HOLM) , 2013 IEEE 59th
Conference_Location :
Newport, RI
ISSN :
1062-6808
Print_ISBN :
978-1-4799-1556-9
Type :
conf
DOI :
10.1109/HOLM.2013.6651425
Filename :
6651425
Link To Document :
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