• DocumentCode
    2006716
  • Title

    Preparation of iron disilicide by sintering with Cu addition and their thermoelectric properties

  • Author

    Ito, Mikio ; Nagai, Hiroshi ; Tanaka, Takashi ; Katsuyama, Shigeru ; Majima, Kazuhiko

  • Author_Institution
    Dept. of Mater. Sci. & Process., Osaka Univ., Japan
  • fYear
    1999
  • fDate
    Aug. 29 1999-Sept. 2 1999
  • Firstpage
    157
  • Lastpage
    160
  • Abstract
    The effects of Cu addition to /spl beta/-FeSi/sub 2/ on the pressureless sintering behavior and thermoelectric properties have been investigated. The transformation to the /spl beta/-phase from the /spl alpha/+/spl epsiv/ phase is significantly promoted by Cu addition because the supply of Si atoms for the /spl epsiv/-phase is enhanced through the Cu-Si liquid phase. Densification of the compacts is also remarkably promoted by the liquid phase sintering. The thermoelectric properties are compared to the conventionally hot-pressed samples. The Seebeck coefficient and resistivity are lower than those of the hot-pressed samples. Many small pores are detected in the pressureless sintered samples based on SEM observations, which effectively lowers the thermal conductivity. The figure of merit similar to the hot-pressed samples is obtained for the sample with a 4 wt.% Cu addition.
  • Keywords
    Seebeck effect; copper; densification; electrical resistivity; iron compounds; sintering; thermal conductivity; /spl alpha/+/spl epsiv/ phase; /spl beta/-FeSi/sub 2/; Cu addition; FeSi/sub 2/:Cu; SEM; Seebeck coefficient; densification; figure of merit; liquid phase sintering; pressureless sintering; resistivity; thermal conductivity; thermoelectric properties; Argon; Atmosphere; Atmospheric measurements; Copper; Iron; Plasma temperature; Powders; Temperature measurement; Thermal conductivity; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 1999. Eighteenth International Conference on
  • Conference_Location
    Baltimore, MD, USA
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-5451-6
  • Type

    conf

  • DOI
    10.1109/ICT.1999.843357
  • Filename
    843357