• DocumentCode
    2006887
  • Title

    Optimization of the thermoelectric properties of low-dimensional structures via phonon engineering

  • Author

    Balandin, A. ; Khitun, A. ; Liu, J.L. ; Wang, K.L. ; Borca-Tasciuc, T. ; Chen, G.

  • Author_Institution
    Dept. of Electr. Eng., California Univ., Riverside, CA, USA
  • fYear
    1999
  • fDate
    Aug. 29 1999-Sept. 2 1999
  • Firstpage
    189
  • Lastpage
    192
  • Abstract
    We report the first direct observation of confined acoustic phonon modes in a single semiconductor thin film. High-resolution Raman spectroscopy of ultra-thin silicon-on-insulator (SOI) structures reveals multiple quasi-equidistant peaks in the spectral range from 50 cm/sup -1/ to 160 cm/sup -1/. Confined nature of phonon transport in low-dimensional structures with the finite acoustic mismatch indicates an additional tuning capability for optimizing of thermoelectric properties of these structures. Our experimental results are consistent with the recent theoretical predictions of the strong decrease of the lateral lattice thermal conductivity due to phonon confinement.
  • Keywords
    Raman spectra; electron-phonon interactions; silicon-on-insulator; thermal conductivity; thermoelectric power; Raman spectroscopy; Si; confined acoustic phonon modes; finite acoustic mismatch; lateral lattice thermal conductivity; low-dimensional structures; phonon confinement; phonon engineering; phonon transport; single semiconductor thin film; thermoelectric properties; tuning capability; ultra-thin silicon-on-insulator structures; Acoustic materials; Laboratories; Phonons; Polymer films; Semiconductor films; Semiconductor materials; Semiconductor superlattices; Semiconductor thin films; Thermal conductivity; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 1999. Eighteenth International Conference on
  • Conference_Location
    Baltimore, MD, USA
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-5451-6
  • Type

    conf

  • DOI
    10.1109/ICT.1999.843365
  • Filename
    843365