DocumentCode :
2007265
Title :
Convection correction factor determination for use with the transient test method for thermoelectric modules
Author :
Lau, Paul G.
Author_Institution :
TE Technol. Inc., MI, USA
fYear :
1999
fDate :
Aug. 29 1999-Sept. 2 1999
Firstpage :
252
Lastpage :
255
Abstract :
The transient test method used by TE Technology, Inc. requires a small temperature difference to be developed across a thermoelectric module in order to measure its figure-of-merit, Z. Correction factors associated with radiation, conduction, and convection must then be applied to the measurements in order to determine the actual Z of the N and P average of the thermoelectric materials comprising the module. The accuracy of these correction factors will affect the accuracy of the Z. Radiation and conduction can be calculated with the same accuracy regardless of the size of the module, but convection is inherently size dependent. Factoring in the temperature dependence for convection is also more complex. Therefore, several different sizes of modules were measured in air and in vacuum. Comparison between the Z measured in vacuum and in air were used to test the validity of convection correlations as applied to thermoelectric modules. Recommendations are made for the best correlation to use in determining the convection correction factor.
Keywords :
convection; temperature measurement; testing; thermoelectric devices; transients; TE Technology; conduction; convection; convection correction factor determination; figure-of-merit measurement; radiation; temperature dependence; thermoelectric materials; thermoelectric modules; transient test method; Cities and towns; Conducting materials; Geometry; Heat transfer; Materials testing; Tellurium; Temperature dependence; Temperature measurement; Thermoelectricity; Time to market;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermoelectrics, 1999. Eighteenth International Conference on
Conference_Location :
Baltimore, MD, USA
ISSN :
1094-2734
Print_ISBN :
0-7803-5451-6
Type :
conf
DOI :
10.1109/ICT.1999.843381
Filename :
843381
Link To Document :
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