Title :
High reliability thermoelectric cooling modules
Author :
Gouliaev, A. ; Holopkin, A.
Author_Institution :
JSC Electron., Moscow, Russia
fDate :
Aug. 29 1999-Sept. 2 1999
Abstract :
Large thermoelectric cooling/heating systems need in plenty of high reliability thermoelectric cooling modules (TCMs). In this paper we present the TCM manufacturing processes developed with the aim to significantly reduce internal mechanical stresses in TCMs and increase their reliability. TCMs were subjected to two long-time thermocycling tests. The tests included the sequence of operations of heating and cooling one TCM side by passing electric current through TCM in temperature ranges from -15/spl deg/C up to 85/spl deg/C and 35/spl deg/C up to 95/spl deg/C. Typically TCMs passed successfully more than 6000 and 50000 thermocycles in the first and second tests respectively without failure. The ways of TCM reliability increase are discussed.
Keywords :
cooling; reliability; thermocouples; thermoelectric devices; high reliability thermoelectric cooling modules; large thermoelectric cooling/heating systems; long-time thermocycling tests; reduce internal mechanical stresses; Bars; Bismuth; Ceramics; Cooling; Copper; Current measurement; Electric variables measurement; Temperature; Testing; Thermoelectricity;
Conference_Titel :
Thermoelectrics, 1999. Eighteenth International Conference on
Conference_Location :
Baltimore, MD, USA
Print_ISBN :
0-7803-5451-6
DOI :
10.1109/ICT.1999.843393