• DocumentCode
    2007506
  • Title

    High reliability thermoelectric cooling modules

  • Author

    Gouliaev, A. ; Holopkin, A.

  • Author_Institution
    JSC Electron., Moscow, Russia
  • fYear
    1999
  • fDate
    Aug. 29 1999-Sept. 2 1999
  • Firstpage
    319
  • Lastpage
    320
  • Abstract
    Large thermoelectric cooling/heating systems need in plenty of high reliability thermoelectric cooling modules (TCMs). In this paper we present the TCM manufacturing processes developed with the aim to significantly reduce internal mechanical stresses in TCMs and increase their reliability. TCMs were subjected to two long-time thermocycling tests. The tests included the sequence of operations of heating and cooling one TCM side by passing electric current through TCM in temperature ranges from -15/spl deg/C up to 85/spl deg/C and 35/spl deg/C up to 95/spl deg/C. Typically TCMs passed successfully more than 6000 and 50000 thermocycles in the first and second tests respectively without failure. The ways of TCM reliability increase are discussed.
  • Keywords
    cooling; reliability; thermocouples; thermoelectric devices; high reliability thermoelectric cooling modules; large thermoelectric cooling/heating systems; long-time thermocycling tests; reduce internal mechanical stresses; Bars; Bismuth; Ceramics; Cooling; Copper; Current measurement; Electric variables measurement; Temperature; Testing; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 1999. Eighteenth International Conference on
  • Conference_Location
    Baltimore, MD, USA
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-5451-6
  • Type

    conf

  • DOI
    10.1109/ICT.1999.843393
  • Filename
    843393