DocumentCode
2007506
Title
High reliability thermoelectric cooling modules
Author
Gouliaev, A. ; Holopkin, A.
Author_Institution
JSC Electron., Moscow, Russia
fYear
1999
fDate
Aug. 29 1999-Sept. 2 1999
Firstpage
319
Lastpage
320
Abstract
Large thermoelectric cooling/heating systems need in plenty of high reliability thermoelectric cooling modules (TCMs). In this paper we present the TCM manufacturing processes developed with the aim to significantly reduce internal mechanical stresses in TCMs and increase their reliability. TCMs were subjected to two long-time thermocycling tests. The tests included the sequence of operations of heating and cooling one TCM side by passing electric current through TCM in temperature ranges from -15/spl deg/C up to 85/spl deg/C and 35/spl deg/C up to 95/spl deg/C. Typically TCMs passed successfully more than 6000 and 50000 thermocycles in the first and second tests respectively without failure. The ways of TCM reliability increase are discussed.
Keywords
cooling; reliability; thermocouples; thermoelectric devices; high reliability thermoelectric cooling modules; large thermoelectric cooling/heating systems; long-time thermocycling tests; reduce internal mechanical stresses; Bars; Bismuth; Ceramics; Cooling; Copper; Current measurement; Electric variables measurement; Temperature; Testing; Thermoelectricity;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 1999. Eighteenth International Conference on
Conference_Location
Baltimore, MD, USA
ISSN
1094-2734
Print_ISBN
0-7803-5451-6
Type
conf
DOI
10.1109/ICT.1999.843393
Filename
843393
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