Planar bond all: A new packaging technology for advanced automotive power modules

A novel packaging structure for liquid cooled automotive power modules is developed. It features sandwiching power semiconductor switches between two symmetric substrates, which serve electrical interconnection and insulation. Two mini coolers are directly bonded to the outside of these substrates, allowing double sided, integrated cooling. The power switches in a popular phase leg electrical topology are orientated in a face up/face down three-dimensional (3-D) interconnection configuration. The bonding areas between dies and substrates, substrates and coolers are designed to use identical materials and formed in one heating process, in which a special fixture has been made so that a high efficiency production can be implemented. Combining these features with the thermal and electrical advancements, this packaging technology offers dramatically comprehensive improvements in power module´s cost effectiveness, electrical conversion efficiency and thermal management, as demonstrated by a planar bond packaged prototype of a 200A/1200V phase leg power module.