DocumentCode
2007537
Title
Thermal management: Effect of heat shielding using thin metal cylinders on a dispenser cathode temperature
Author
Busbaher, Daniel
Author_Institution
Semicon Assoc., Lexington, KY
fYear
2008
fDate
22-24 April 2008
Firstpage
344
Lastpage
345
Abstract
This paper will present results of research on the effect of heat shielding/sinking on cathode temperature. It will show how the alteration of heat shield thickness, space between cathode wall and heat shield, and/or space between multiple heat shields affects the cathode surface temperature. Results will be compared with theoretical results based on a radiation heat transfer theory in order to find a reliable way to include this theory in the design process.
Keywords
cathodes; heat sinks; heat transfer; shielding; thermal management (packaging); cathode surface temperature; design process; dispenser cathode temperature; heat shielding; heat sinking; radiation heat transfer theory; thermal management; thin metal cylinders; Cathodes; Drives; Heat sinks; Heat transfer; Manufacturing processes; Performance evaluation; Space heating; Temperature; Testing; Thermal management; cathode temperature; dispenser cathode; heat shield;
fLanguage
English
Publisher
ieee
Conference_Titel
Vacuum Electronics Conference, 2008. IVEC 2008. IEEE International
Conference_Location
Monterey, CA
Print_ISBN
978-1-4244-1715-5
Type
conf
DOI
10.1109/IVELEC.2008.4556523
Filename
4556523
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