• DocumentCode
    2007537
  • Title

    Thermal management: Effect of heat shielding using thin metal cylinders on a dispenser cathode temperature

  • Author

    Busbaher, Daniel

  • Author_Institution
    Semicon Assoc., Lexington, KY
  • fYear
    2008
  • fDate
    22-24 April 2008
  • Firstpage
    344
  • Lastpage
    345
  • Abstract
    This paper will present results of research on the effect of heat shielding/sinking on cathode temperature. It will show how the alteration of heat shield thickness, space between cathode wall and heat shield, and/or space between multiple heat shields affects the cathode surface temperature. Results will be compared with theoretical results based on a radiation heat transfer theory in order to find a reliable way to include this theory in the design process.
  • Keywords
    cathodes; heat sinks; heat transfer; shielding; thermal management (packaging); cathode surface temperature; design process; dispenser cathode temperature; heat shielding; heat sinking; radiation heat transfer theory; thermal management; thin metal cylinders; Cathodes; Drives; Heat sinks; Heat transfer; Manufacturing processes; Performance evaluation; Space heating; Temperature; Testing; Thermal management; cathode temperature; dispenser cathode; heat shield;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Vacuum Electronics Conference, 2008. IVEC 2008. IEEE International
  • Conference_Location
    Monterey, CA
  • Print_ISBN
    978-1-4244-1715-5
  • Type

    conf

  • DOI
    10.1109/IVELEC.2008.4556523
  • Filename
    4556523