Title :
Thermal management: Effect of heat shielding using thin metal cylinders on a dispenser cathode temperature
Author :
Busbaher, Daniel
Author_Institution :
Semicon Assoc., Lexington, KY
Abstract :
This paper will present results of research on the effect of heat shielding/sinking on cathode temperature. It will show how the alteration of heat shield thickness, space between cathode wall and heat shield, and/or space between multiple heat shields affects the cathode surface temperature. Results will be compared with theoretical results based on a radiation heat transfer theory in order to find a reliable way to include this theory in the design process.
Keywords :
cathodes; heat sinks; heat transfer; shielding; thermal management (packaging); cathode surface temperature; design process; dispenser cathode temperature; heat shielding; heat sinking; radiation heat transfer theory; thermal management; thin metal cylinders; Cathodes; Drives; Heat sinks; Heat transfer; Manufacturing processes; Performance evaluation; Space heating; Temperature; Testing; Thermal management; cathode temperature; dispenser cathode; heat shield;
Conference_Titel :
Vacuum Electronics Conference, 2008. IVEC 2008. IEEE International
Conference_Location :
Monterey, CA
Print_ISBN :
978-1-4244-1715-5
DOI :
10.1109/IVELEC.2008.4556523
