DocumentCode
2007589
Title
Thermoelectric properties of Sb-doping in the TiNiSn/sub 1-x/Sb/sub x/ half-Heusler system
Author
Bhattacharya, S. ; Ponnambalam, V. ; Pope, A.L. ; Alboni, P.N. ; Xia, Y. ; Tritt, T.M. ; Poon, S.J.
Author_Institution
Dept. of Phys. & Astron., Clemson Univ., SC, USA
fYear
1999
fDate
Aug. 29 1999-Sept. 2 1999
Firstpage
336
Lastpage
339
Abstract
Half Heusler alloys, MNiSn (M=Zr, Hf, Ti) systems, have recently been studied for their potential as new thermoelectric materials. They have shown both high thermopower (/spl alpha/) values (40-250 /spl mu/V/K) and reasonable values of electrical resistivity, /spl rho/ (0.1-8 m/spl Omega/-cm). However, the thermal conductivity in these systems is high for a potential thermoelectric material, on the order of 4-10 W/m-K. In an effort to reduce the thermal conductivity through alloy scattering, Sb is substituted on the Sn site with compositions TiNiSn/sub 1-x/Sb/sub x/ where x=0 to 0.1. With this substitution, the thermopower is only slightly reduced while the resistivity is reduced by approximately one order of magnitude resulting in marked improvement in the power factor (/spl alpha//sup 2/T//spl rho/). Thermopower, resistivity, and thermal conductivity have been measured on a series of Sb doped TiNiSn samples from 10 K\n\n\t\t
Keywords
antimony alloys; electrical resistivity; nickel alloys; thermal conductivity; thermoelectric power; tin alloys; titanium alloys; Hall measurements; Sb-doping; TiNi(SnSb); TiNiSn/sub 1-x/Sb/sub x/ half-Heusler system; electrical resistivity; heat capacity; high thermopower; room temperature power factor; thermal conductivity; thermoelectric materials; thermoelectric properties; Conducting materials; Conductivity measurement; Electric resistance; Hafnium; Reactive power; Scattering; Thermal conductivity; Thermoelectricity; Tin alloys; Titanium alloys;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 1999. Eighteenth International Conference on
Conference_Location
Baltimore, MD, USA
ISSN
1094-2734
Print_ISBN
0-7803-5451-6
Type
conf
DOI
10.1109/ICT.1999.843398
Filename
843398
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