Title :
Thermoelectric properties of CoSb/sub 3/ with oxide particles dispersion
Author :
Katsuyama, S. ; Kusaka, H. ; Ito, M. ; Majima, K. ; Nagai, H.
Author_Institution :
Dept. of Mater. Sci. & Process., Osaka Univ., Japan
fDate :
Aug. 29 1999-Sept. 2 1999
Abstract :
We have prepared (1-x)CoSb/sub 3/-x(oxide) composite (x=0.1-0.3) where the oxide particles are dispersed in the CoSb/sub 3/ matrix by the MG (mechanical grinding) technique. The electrical resistivity of CoSb/sub 3/ is reduced by addition of MoO/sub 2/ or WO/sub 2/, but it is enhanced by addition of Al/sub 2/O/sub 3/. This is because the electrical resistivity of MoO/sub 2/ or WO/sub 2/ is smaller than that of CoSb/sub 3/, while Al/sub 2/O/sub 3/ is an insulator. The electrical resistivity increases with an increase of the MG time. The thermal conductivity is reduced by the addition of oxide and it decreases with increasing MG time. As a result, 0.7CoSb/sub 3/-0.3MoO/sub 2/ composite exposed to 3h MG treatment or 0.9CoSb/sub 3/-0.1WO/sub 2/ composite exposed to 7h MG treatment has a maximum figure of merit of 3.6/spl times/10/sup -4/ K/sup -1/ at about 580K, which is slightly larger than that of CoSb/sub 3/ at 482K, 3.2/spl times/10/sup -4/.
Keywords :
Seebeck effect; alumina; cobalt compounds; electrical resistivity; molybdenum compounds; powder technology; thermal conductivity; tungsten compounds; CoSb/sub 3/-Al/sub 2/O/sub 3/; CoSb/sub 3/-MoO/sub 2/; CoSb/sub 3/-WO/sub 2/; Seebeck coefficient; electrical resistivity; figure of merit; mechanical grinding; oxide particles dispersion; thermal conductivity; Alloying; Conducting materials; Electric resistance; Grain boundaries; Grain size; Particle scattering; Powders; Solids; Thermal conductivity; Thermoelectricity;
Conference_Titel :
Thermoelectrics, 1999. Eighteenth International Conference on
Conference_Location :
Baltimore, MD, USA
Print_ISBN :
0-7803-5451-6
DOI :
10.1109/ICT.1999.843401