• DocumentCode
    2008109
  • Title

    Quick method for determining the reliability of a thermoelectric module via pulse testing

  • Author

    Ritzer, Todd M.

  • Author_Institution
    TE Technol. Inc., Traverse City, MI, USA
  • fYear
    1999
  • fDate
    Aug. 29 1999-Sept. 2 1999
  • Firstpage
    432
  • Lastpage
    435
  • Abstract
    Users and manufacturers of thermoelectric modules (TEMs) are experiencing increasing demand for reliable products. As the volumes of manufactured TEMs increase, the need for a faster method of reliability testing is essential to minimize costs while ensuring the overall quality of the product. The typical methods of reliability testing can take as many as 3-4 months to determine the projected operational life of a TEM. In many cases, there is not enough time or resources to qualify the growing manufactured quantities of TEMs, until now. TE Technology has developed a pulse test method to quickly determine the integrity of the most crucial components within the TEM. This test process consists of applying a high magnitude, but very short duration, AC pulse through a TEM. This energy burst preferentially generates heat, pin-pointed wherever high contact resistance may be present throughout the TEM. These "Hot Spots" can be observed through thermal imaging methods applied to the exterior ceramics. Thus, every junction in the TEM is tested. Analyses of these thermal images are used to identify potential future failures. Test data will be presented to correlate the results of the pulse tests with those obtained from longer term, conventional reliability testing.
  • Keywords
    reliability; thermoelectric devices; high contact resistance; potential future failures; projected operational life; pulse testing; reliability; thermoelectric module; Contact resistance; Electric resistance; Electrodes; Heterojunctions; Manufacturing; Pulsed power supplies; Tellurium; Testing; Thermal stresses; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 1999. Eighteenth International Conference on
  • Conference_Location
    Baltimore, MD, USA
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-5451-6
  • Type

    conf

  • DOI
    10.1109/ICT.1999.843423
  • Filename
    843423