Title :
A membrane type Si-MEMS tactile imager with fingerprint structure for realization of slip sensing capability
Author :
Okada, Hiroki ; Yawata, Masaki ; Ishida, Makoto ; Sawada, Kazuaki ; Takao, Hidekuni
Author_Institution :
Toyohashi Univ. of Technol., Toyohashi, Japan
Abstract :
This paper reports a newly developed Si-MEMS integrated tactile imager that can detect tri-axial input force and `slip´ on the surface of the sensor in high spatial resolution (several hundreds micron). Tactile imaging is performed by a large area silicon membrane which is integrating sensor pixel array including strain gauge circuits. The new imager device presented in this paper has fingerprint-like patterns formed by Deep-RIE on the silicon sensor diaphragm. The patterns generate a rotational motion for horizontal axis input force, and it is similar with the role of human´s fingerprints. Basic principle of the tactile imager was examined with FEM analysis for multi-axis input forces and the slip sensing ability. In addition, tri-axial load was successfully detected in each pixel by the new membrane sensor structure with low cross-axis sensitivities.
Keywords :
finite element analysis; microsensors; tactile sensors; FEM analysis; Si-MEMS integrated tactile imager; fingerprint structure; fingerprint-like patterns; high spatial resolution; horizontal axis input force; imager device; large area silicon membrane; membrane sensor structure; microelectromechanical system; rotational motion; sensor pixel array; silicon sensor diaphragm; slip sensing ability; slip sensing capability; strain gauge circuits; tactile imaging; tri-axial input force; tri-axial load; Biomembranes; Fingerprint recognition; Force sensors; High-resolution imaging; Image sensors; Pixel; Sensor arrays; Silicon; Spatial resolution; Tactile sensors;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
Conference_Location :
Wanchai, Hong Kong
Print_ISBN :
978-1-4244-5761-8
Electronic_ISBN :
1084-6999
DOI :
10.1109/MEMSYS.2010.5442333