Title :
Table of contents
Abstract :
The following topics are dealt with: chip-package-interaction; low-k films; reliability; memories; integrated circuit interconnect; 3D integration; process integration; power and automotive interconnect; and metal gate.
Keywords :
integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; integrated memory circuits; low-k dielectric thin films; power integrated circuits; three-dimensional integrated circuits; 3D integration; automotive interconnect; chip-package-interaction; integrated circuit interconnect; integrated circuit reliability; low-k films; memories; metal gate; power interconnect; process integration;
Conference_Titel :
Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International
Conference_Location :
Dresden
Print_ISBN :
978-1-4577-0503-8
DOI :
10.1109/IITC.2011.5940255
