Coaxial polymer pillars: ultra-low inductance compliant wafer-level electrical input/output interconnects for power distribution

Author

Shakeri, Kaveh ; Bakir, Muhannad ; Meindl, James D.

Author_Institution

Microelectron. Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2004

fDate

12-15 Sept. 2004

Firstpage

78

Lastpage

81

Abstract

An ultralow inductance I/O interconnect, called a coaxial polymer pillar (CoPP) is introduced that is compatible with sea of polymer pillars (SoPP) recently presented. Polymer pillars are highly process-integrated and mechanically flexible (compliant) electrical-optical I/O interconnections that mitigate thermomechanical expansion mismatches. The 100x smaller parasitic inductance of the CoPP (in the range of 0.1 pH) compared to the inductance of a solder bump or a regular polymer pillar makes it an excellent I/O interconnect technology for power distribution. The density of CoPPs may exceed 10⁵/cm².

Keywords

VLSI; integrated circuit interconnections; integrated circuit noise; polymers; power distribution; VLSI; coaxial polymer pillars; electrical-optical I/O interconnections; ground bounce; input/output interconnects; power distribution; simultaneous switching noise; thermomechanical expansion mismatch; ultra-low inductance I/O interconnect; Coaxial components; Dielectrics; Frequency; Inductance; Packaging; Parasitic capacitance; Polymers; Power distribution; Power systems; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

SOC Conference, 2004. Proceedings. IEEE International

Print_ISBN

0-7803-8445-8

Type

conf

DOI

10.1109/SOCC.2004.1362356

Filename

1362356