CMOs sensor chip with a 10×10 array of unit cells for mapping five stress components and temperature

This paper reports on the development and characterization of a novel stress and temperature mapping chip fabricated in a standard 0.6 ¿m CMOS process. The sensing array consists of 10 × 10 square unit cells enabling the simultaneous measurement of the absolute temperature as well as five independent mechanical stress components in a temperature compensated manner. These components are (i) the difference of in-plane normal stresses ¿_xx - ¿_yy , (ii) the in-plane shear stress s_xy , (iii, iv) the out-of-plane shear stress components ¿_xz and ¿_yz and (v) the linear combination of the three normal stress components ¿_¿ = (¿_xx + ¿_yy)/2 - ß ¿_zz. As application examples, stress distributions generated by applying a local force and an inhomogeneous temperature distribution across the chip were mapped.