• DocumentCode
    2008551
  • Title

    Sponsors

  • fYear
    2011
  • fDate
    8-12 May 2011
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    The conference organizers greatly appreciate the support of the various corporate sponsors listed.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International
  • Conference_Location
    Dresden
  • ISSN
    pending
  • Print_ISBN
    978-1-4577-0503-8
  • Type

    conf

  • DOI
    10.1109/IITC.2011.5940259
  • Filename
    5940259
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2008551