DocumentCode :
2008551
Title :
Sponsors
fYear :
2011
fDate :
8-12 May 2011
Firstpage :
1
Lastpage :
1
Abstract :
The conference organizers greatly appreciate the support of the various corporate sponsors listed.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International
Conference_Location :
Dresden
ISSN :
pending
Print_ISBN :
978-1-4577-0503-8
Type :
conf
DOI :
10.1109/IITC.2011.5940259
Filename :
5940259
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2008551
