Title :
Process transfers provide opportunities for more reliable products
Author :
Kuper, Fred ; Wessels, Piet ; Ooms, Eric ; Van Herk, Joost ; Rijnsburger, Marcel ; Van Driel, Willem ; Plagge, Jos
Author_Institution :
NXP Semicond., Nijmegen, Netherlands
Abstract :
In this paper the challenges and opportunities of a wafer fab process transfer are explained. Details and background of methodologies and choices made in the transfer of the back-end-of-line of a state-of-the-art SOI automotive process are explained. Field reliability results validate the choices made.
Keywords :
automotive electronics; integrated circuit reliability; silicon-on-insulator; back-end-of-line process; field reliability; state-of-the-art SOI automotive process; wafer fab process transfer; Automotive engineering; Integrated circuits; Metals; Production facilities; Robustness; Semiconductor device reliability;
Conference_Titel :
Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International
Conference_Location :
Dresden
Print_ISBN :
978-1-4577-0503-8
DOI :
10.1109/IITC.2011.5940265
