Title :
0.25/spl mu/m Contact Hole Filling by Al-Ge Reflow Sputtering
Author :
Kikuta, K. ; Kikkawa, T. ; Aoki, H.
Author_Institution :
Microelectronics Research Laboratories, NEC Corporation, Japan
Keywords :
Aluminum alloys; Conductivity; Contacts; Filling; Microelectronics; Sputter etching; Sputtering; Substrates; Surface morphology; Temperature;
Conference_Titel :
VLSI Technology, 1991. Digest of Technical Papers., 1991 Symposium on
Conference_Location :
Oiso, Japan
DOI :
10.1109/VLSIT.1991.705977
