• DocumentCode
    2009404
  • Title

    Electronic structure of Sb/sub 2/Te/sub 3/ under pressure

  • Author

    Bartkowiak, M. ; Mahan, G.D.

  • Author_Institution
    Dept. of Phys. & Astron., Tennessee Univ., Knoxville, TN, USA
  • fYear
    1999
  • fDate
    Aug. 29 1999-Sept. 2 1999
  • Firstpage
    713
  • Lastpage
    716
  • Abstract
    Recent experimental data indicate that thermoelectric properties of alloys commonly used in room-temperature cooling devices, Sb/sub 2/Te/sub 3/ and Bi/sub 2/Te/sub 3/, improve significantly under pressure. Here we analyze the structure and the electronic properties of Sb/sub 2/Te/sub 3/ under pressure within the framework of density functional theory using the relativistic version of the full potential linearized augmented plane wave (FP-LAPW) method. We use an approach that does not require any external input. First, we calculate the crystallographic parameters as a function of pressure and show that the results are in reasonable agreement with the available experimental data. Then, we calculate the electronic band structure of the material under pressure and discuss its properties. It is shown that the band gap of Sb/sub 2/Te/sub 3/ reduces under pressure and closes completely at about 2 GPa. This is consistent with the experimental data on the resistivity. Other details of the pressure dependence of the band structure are also discussed.
  • Keywords
    APW calculations; antimony compounds; crystal structure; density functional theory; energy gap; high-pressure effects; semiconductor materials; FP-LAPW method; Sb/sub 2/Te/sub 3/; band gap; crystal structure; density functional theory; electronic band structure; pressure dependence; Bismuth; Crystalline materials; Crystallography; Density functional theory; Electronics cooling; Photonic band gap; Tellurium; Thermoelectric devices; Thermoelectricity; Tin alloys;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 1999. Eighteenth International Conference on
  • Conference_Location
    Baltimore, MD, USA
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-5451-6
  • Type

    conf

  • DOI
    10.1109/ICT.1999.843485
  • Filename
    843485