DocumentCode
2009404
Title
Electronic structure of Sb/sub 2/Te/sub 3/ under pressure
Author
Bartkowiak, M. ; Mahan, G.D.
Author_Institution
Dept. of Phys. & Astron., Tennessee Univ., Knoxville, TN, USA
fYear
1999
fDate
Aug. 29 1999-Sept. 2 1999
Firstpage
713
Lastpage
716
Abstract
Recent experimental data indicate that thermoelectric properties of alloys commonly used in room-temperature cooling devices, Sb/sub 2/Te/sub 3/ and Bi/sub 2/Te/sub 3/, improve significantly under pressure. Here we analyze the structure and the electronic properties of Sb/sub 2/Te/sub 3/ under pressure within the framework of density functional theory using the relativistic version of the full potential linearized augmented plane wave (FP-LAPW) method. We use an approach that does not require any external input. First, we calculate the crystallographic parameters as a function of pressure and show that the results are in reasonable agreement with the available experimental data. Then, we calculate the electronic band structure of the material under pressure and discuss its properties. It is shown that the band gap of Sb/sub 2/Te/sub 3/ reduces under pressure and closes completely at about 2 GPa. This is consistent with the experimental data on the resistivity. Other details of the pressure dependence of the band structure are also discussed.
Keywords
APW calculations; antimony compounds; crystal structure; density functional theory; energy gap; high-pressure effects; semiconductor materials; FP-LAPW method; Sb/sub 2/Te/sub 3/; band gap; crystal structure; density functional theory; electronic band structure; pressure dependence; Bismuth; Crystalline materials; Crystallography; Density functional theory; Electronics cooling; Photonic band gap; Tellurium; Thermoelectric devices; Thermoelectricity; Tin alloys;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 1999. Eighteenth International Conference on
Conference_Location
Baltimore, MD, USA
ISSN
1094-2734
Print_ISBN
0-7803-5451-6
Type
conf
DOI
10.1109/ICT.1999.843485
Filename
843485
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