Title :
A Novel Double-Self-Alicned TiSi2/TiN Contact with Selective Cvd W Plug for Submicron Device and Interconnect Applications
Author :
Wang, M.S. ; Bradbury, D. ; Hu, E.K. ; Chiu, K.Y.
Author_Institution :
Hewlett Packard, Circuit Technology R&D, CA
Keywords :
Chemical technology; Contact resistance; Integrated circuit interconnections; Nitrogen; Plugs; Surface resistance; Tin; Titanium; Tungsten; Wet etching;
Conference_Titel :
VLSI Technology, 1991. Digest of Technical Papers., 1991 Symposium on
Conference_Location :
Oiso, Japan
DOI :
10.1109/VLSIT.1991.705980
