Title :
Estimating reliability and throughput of source-synchronous wave-pipelined interconnect
Author :
Teehan, Paul ; Lemieux, Guy G F ; Greenstreet, Mark R.
Author_Institution :
Univ. of British Columbia, Vancouver, BC
Abstract :
Wave pipelining has gained attention for NoC interconnect by its promise of high bandwidth using simple circuits. Reliability issues must be addressed before wave pipelining can be used in practice; so, we develop a statistical model of dynamic timing uncertainty. We show that it is important to distinguish between static and dynamic sources of timing uncertainty, because source-synchronous wave pipelining is much more sensitive to the latter. We use HSPICE simulations to develop a model for a wave pipelined link in a 65 nm CMOS process and apply a statistical approach to determine the achievable throughput at acceptable bit-error rates. Reliability estimates show that a modest amount of dynamic noise can cut achievable throughput in half for a ten-stage wave-pipelined link, and will further degrade longer links. After accounting for noise, traditional globally synchronous design is shown to offer higher throughput than the wave-pipelined design.
Keywords :
CMOS logic circuits; SPICE; integrated circuit interconnections; multiprocessor interconnection networks; network-on-chip; pipeline processing; CMOS process; HSPICE simulation; NoC interconnect reliability estimation; bit-error rate estimation; dynamic timing uncertainty; network-on-chip; pipelining practice; size 65 nm; source-synchronous wave-pipelined interconnect; synchronous design dynamic noise; wave-pipelined link; Bandwidth; Bit error rate; CMOS process; Integrated circuit interconnections; Network-on-a-chip; Pipeline processing; Semiconductor device modeling; Throughput; Timing; Uncertainty;
Conference_Titel :
Networks-on-Chip, 2009. NoCS 2009. 3rd ACM/IEEE International Symposium on
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-4142-6
Electronic_ISBN :
978-1-4244-4143-3
DOI :
10.1109/NOCS.2009.5071472