• DocumentCode
    2010187
  • Title

    Cracking pressure control of parylene checkvalve using slanted tensile tethers

  • Author

    Lin, Jeffrey Chun-Hui ; Yu, Feiqiao ; Tai, Yu-Chong

  • Author_Institution
    California Inst. of Technol., Pasadena, CA, USA
  • fYear
    2010
  • fDate
    24-28 Jan. 2010
  • Firstpage
    1107
  • Lastpage
    1110
  • Abstract
    MEMS check valves with fixed cracking pressures are important in micro-fluidic applications where the pressure, flow directions and flow rates all need to be carefully controlled. This work presents a new surface-micromachined parylene check valve that uses residual thermal stress in the parylene to control its cracking pressure. The new check valve uses slanted tethers to allow the parylene tensile stress to apply a net downward force on the valving seat against the orifice. The angle of the slanted tethers is made using a gray-scale mask to create a sloped sacrificial photoresist with the following tether parylene deposition. The resulted check valves have both the cracking pressures and flow profiles agreeable well with our theoretical analysis.
  • Keywords
    flow control; microfabrication; microfluidics; microvalves; photoresists; polymers; pressure control; process design; thermal stress cracking; cracking pressure control; gray-scale mask; microfluidic applications; micromechanical device check valves; orifice; parylene check valve; parylene tensile stress; residual thermal stress; slanted tensile tethers; sloped sacrificial photoresist; surface-micromachined check valve; tether parylene deposition; Gray-scale; Micromechanical devices; Orifices; Pressure control; Residual stresses; Stress control; Surface cracks; Tensile stress; Thermal stresses; Valves;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
  • Conference_Location
    Wanchai, Hong Kong
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-5761-8
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2010.5442404
  • Filename
    5442404