• DocumentCode
    2010220
  • Title

    Organic photoconductive dielectrophoresis by using titanium oxide phthalocyanine for micro-particles manupulation

  • Author

    Yu, Tung-Ming ; Yang, Shi-Mo ; Huang, Hang-Ping ; Ku, Meng-Yen ; Tseng, Sheng-Yang ; Liu, Ming-Huei ; Hsu, Long ; Liu, Cheng-Hsien

  • Author_Institution
    Nat. Chiao-Tung Univ., Hsinchu, Taiwan
  • fYear
    2010
  • fDate
    24-28 Jan. 2010
  • Firstpage
    1119
  • Lastpage
    1122
  • Abstract
    This paper reports our updating development for the organic photoconductive dielectrophoresis (OPDEP) by using titanium oxide phthalocyanine (TiOPc) material for the manipulation of micro-objects. The advantages of organic photoconductive material include non-toxicity, low cost, easy coating fabrication, flexibility, panchromaticity and high photosensitivity. TiOPc has the high photoconductivity and the optical absorptions in the near infrared region (550 - 850 nm) to be a candidate of the light-sensitive charge generation layer. OPDEP chip is easily mass-produced by using a spin-coating process. Here, we demonstrate two kinds of the manipulations of micro-particles on our OPDEP chip. Firstly, the trapping and movement of single micro-particle is achieved by the ring shaped virtual electrode. Secondly, the steel rim shaped virtual electrode is designed to rotate micro-particles and characterize the OPDEP induced force.
  • Keywords
    electrophoresis; photochemistry; photoconducting materials; spin coating; titanium compounds; coating fabrication; microparticles manipulation; near infrared region; optical absorptions; organic photoconductive dielectrophoresis; photoconductive material; photosensitivity; spin-coating process; titanium oxide phthalocyanine; Coatings; Costs; Dielectrophoresis; Electrodes; Optical device fabrication; Optical materials; Organic materials; Photoconducting materials; Photoconductivity; Titanium;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
  • Conference_Location
    Wanchai, Hong Kong
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-5761-8
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2010.5442407
  • Filename
    5442407