Title :
Wavelet-based neural network prediction of plasma etch profile nonuniformity
Author :
Kim, Bumki ; Kim, Sungho ; Kim, Kunsu
Author_Institution :
Dept. of Electron. Eng., Sejong Univ. 98, Seoul, South Korea
Abstract :
Summary form only given, as follows. Profiles of plasma etching have conventionally been characterized by approximating the slope with an angle or anisotropy. This is critically limited in that detailed variations on the profile surface are inevitably neglected. In current high density plasma etching, this becomes more serious since unexpected microfeatures such as bowing or microtrenching are frequently formed along the profile surface.
Keywords :
neural nets; physics computing; sputter etching; wavelet transforms; bowing; high density plasma etching; microtrenching; plasma etch profile nonuniformity; profile surface; wavelet-based neural network prediction; Discrete wavelet transforms; Etching; Neural networks; Plasma applications; Plasma waves; Predictive models; Scanning electron microscopy; Semiconductor device modeling; Semiconductor films; Testing;
Conference_Titel :
Plasma Science, 2003. ICOPS 2003. IEEE Conference Record - Abstracts. The 30th International Conference on
Conference_Location :
Jeju, South Korea
Print_ISBN :
0-7803-7911-X
DOI :
10.1109/PLASMA.2003.1228547
