Title :
Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging
Abstract :
The following topics were dealt with: electrical performance tradeoffs of electronic packaging; electrical design; EMI and EMC; modeling and simulation; RF and microwave packaging; measurement techniques; power and ground planes and via modeling; interconnect techniques; capacitance, inductance and crosstalk modeling
Keywords :
packaging; EMC; EMI; RF packaging; capacitance modeling; crosstalk modeling; electrical design; electrical performance; electronic packaging; ground planes; induction modeling; interconnect techniques; measurement techniques; microwave packaging; power planes; simulation; via modeling;
Conference_Titel :
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-2411-0
DOI :
10.1109/EPEP.1994.594033
