• DocumentCode
    2010334
  • Title

    Vertically bidirectional bistable microrelay with magnetostatic and thermal actuations

  • Author

    Wu, Yibo ; Zhang, Congchun ; Ding, Guifu

  • Author_Institution
    Nat. Key Lab. of Nano/Micro Fabrication Technol., Shanghai Jiao Tong Univ., Shanghai, China
  • fYear
    2010
  • fDate
    24-28 Jan. 2010
  • Firstpage
    1139
  • Lastpage
    1142
  • Abstract
    The design and characterization of a novel bidirectional bistable MEMS relay with out-of-plane motion are presented in this paper. The microrelay is actuated vertically by combining with magnetostatic and electrothermal microactuators. This bistability features a permanent magnet actuation without electromagnetic coils where lower power consumption is requested. The device was fabricated by laminated sacrificial thick copper layer process in UV-LIGA. The mechanical performance was characterized using atomic force microscope (AFM) as well as nano indentation tester. Switching between two stable states of the fabricated bidirectional bistable microrelay was successfully validated with WYKO NT1100 optical profiling system.
  • Keywords
    LIGA; atomic force microscopy; microactuators; microrelays; nanoindentation; permanent magnets; AFM; UV-LIGA; WYKO NT1100 optical profiling system; atomic force microscope; bidirectional bistable MEMS relay; electrothermal microactuators; laminated sacrificial thick copper layer; magnetostatic microactuators; nanoindentation tester; out-of-plane motion; permanent magnet actuation; vertically bidirectional bistable microrelay; Atomic force microscopy; Coils; Electromagnetic forces; Electrothermal effects; Magnetostatics; Microactuators; Micromechanical devices; Microrelays; Permanent magnets; Relays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
  • Conference_Location
    Wanchai, Hong Kong
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-5761-8
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2010.5442412
  • Filename
    5442412