Crack propagation and delamination analysis within the die by camera-assisted double cantilever beam technique

Author

Hecker, Michael ; Hentschel, Robert ; Hensel, Marco ; Lehr, Matthias U.

Author_Institution

GLOBALFOUNDRIES Dresden Module One LLC & Co KG, Dresden, Germany

fYear

2011

fDate

8-12 May 2011

Firstpage

1

Lastpage

3

Abstract

Crack propagation in copper-dielectric structures is an important concern regarding die failure, requiring reliable and fast characterization of crack propagation and corresponding adhesion properties. In the present investigation, a modified double cantilever beam (DCB) technique based on optical crack determination by gap opening measurement is utilized for local G_c analysis on interconnect structures for 32 nm technology node and below. In comparison to conventional DCB test set-up, a significant increase in the number of measurement points and thus in the local resolution for G_c is obtained.

Keywords

adhesion; beams (structures); cantilevers; cracks; delamination; dielectric materials; integrated circuit interconnections; Cu; adhesion properties; camera-assisted double cantilever beam; copper-dielectric structures; crack propagation; delamination; die failure; interconnect structures; optical crack determination; Adhesives; Copper; Dielectrics; Length measurement; Materials; Structural beams; Surface cracks;

fLanguage

English

Publisher

ieee

Conference_Titel

Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International

Conference_Location

Dresden

ISSN

pending

Print_ISBN

978-1-4577-0503-8

Type

conf

DOI

10.1109/IITC.2011.5940335

Filename

5940335