DocumentCode :
2010615
Title :
Influence of copper on the catalytic carbon nanotube growth process
Author :
Fiedler, Holger ; Hermann, Sascha ; Schulz, Stefan E. ; Gessner, Thomas
Author_Institution :
Center for Microtechnologies (ZFM), Chemnitz Univ. of Technol., Chemnitz, Germany
fYear :
2011
fDate :
8-12 May 2011
Firstpage :
1
Lastpage :
3
Abstract :
For Cu/carbon nanotube(CNT) hybrid interconnect technology the growth of CNTs on a conductive substrate connected to Cu lines is required. CNTs were grown by catalytic chemical vapour deposition and the effect of a Cu layer beneath was investigated. By electron energy loss spectroscopy (EELS) we found the Cu to diffuse into the catalyst. This influences CNT growth. Therefore, incorporation of a sufficient diffusion barrier between the Cu layer and the substrate is required. As diffusion barriers we used Ta and TaN.
Keywords :
carbon nanotubes; chemical vapour deposition; copper; integrated circuit interconnections; substrates; Cu/carbon nanotube hybrid interconnect technology; catalytic carbon nanotube growth process; catalytic chemical vapour deposition; conductive substrate; copper; diffusion barrier; electron energy loss spectroscopy; Carbon nanotubes; Copper; Nickel; Scanning electron microscopy; Silicon; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International
Conference_Location :
Dresden
ISSN :
pending
Print_ISBN :
978-1-4577-0503-8
Type :
conf
DOI :
10.1109/IITC.2011.5940346
Filename :
5940346
Link To Document :
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