• DocumentCode
    2010615
  • Title

    Influence of copper on the catalytic carbon nanotube growth process

  • Author

    Fiedler, Holger ; Hermann, Sascha ; Schulz, Stefan E. ; Gessner, Thomas

  • Author_Institution
    Center for Microtechnologies (ZFM), Chemnitz Univ. of Technol., Chemnitz, Germany
  • fYear
    2011
  • fDate
    8-12 May 2011
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    For Cu/carbon nanotube(CNT) hybrid interconnect technology the growth of CNTs on a conductive substrate connected to Cu lines is required. CNTs were grown by catalytic chemical vapour deposition and the effect of a Cu layer beneath was investigated. By electron energy loss spectroscopy (EELS) we found the Cu to diffuse into the catalyst. This influences CNT growth. Therefore, incorporation of a sufficient diffusion barrier between the Cu layer and the substrate is required. As diffusion barriers we used Ta and TaN.
  • Keywords
    carbon nanotubes; chemical vapour deposition; copper; integrated circuit interconnections; substrates; Cu/carbon nanotube hybrid interconnect technology; catalytic carbon nanotube growth process; catalytic chemical vapour deposition; conductive substrate; copper; diffusion barrier; electron energy loss spectroscopy; Carbon nanotubes; Copper; Nickel; Scanning electron microscopy; Silicon; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International
  • Conference_Location
    Dresden
  • ISSN
    pending
  • Print_ISBN
    978-1-4577-0503-8
  • Type

    conf

  • DOI
    10.1109/IITC.2011.5940346
  • Filename
    5940346