Title :
Mutual inductance modeling for multiple RLC interconnects with application to shield insertion
Author :
Zhang, Junmou ; Friedman, Eby G.
Author_Institution :
Dept. of Electr. & Comput. Eng., Rochester Univ., NY, USA
Abstract :
An effective mutual inductance is proposed in this paper to efficiently describe the inductive interactions among coupled signal lines. An efficient estimate of the crosstalk noise among multiple coupled RLC interconnects is achieved by simplifying the system of coupled lines into only two coupled RLC interconnects. The concept of an effective mutual inductance is further applied to a shielding technique, providing guidelines for inserting shields to reduce crosstalk noise in the presence of both capacitive and inductive coupling.
Keywords :
RLC circuits; crosstalk; inductance; integrated circuit interconnections; integrated circuit modelling; integrated circuit noise; capacitive coupling; coupled RLC interconnects; coupled signal lines; crosstalk noise; inductive coupling; multiple RLC interconnects; mutual inductance modeling; shield insertion; Contracts; Crosstalk; Delay effects; Guidelines; Inductance; Integrated circuit interconnections; Integrated circuit modeling; Mutual coupling; Noise reduction; Wires;
Conference_Titel :
SOC Conference, 2004. Proceedings. IEEE International
Print_ISBN :
0-7803-8445-8
DOI :
10.1109/SOCC.2004.1362457