Title :
Effect of oxygen diffusion into TiN on resistance switching characteristics of ZrO2 films with annealing temperatures
Author :
Kim, Jonggi ; Lee, Sunghoon ; Na, Heedo ; Lee, Kyumin ; Sohn, Hyunchul
Author_Institution :
Dept. of Mater. Sci. & Eng., Yonsei Univ., Seoul, South Korea
Abstract :
In this study, the effects of annealing temperature on both physical and resistive switching properties of ZrO2 films were investigated. XRD showed the increase of the monoclinic phase in the as-grown tetragonal ZrO2 with annealing above 450°C. The ZrO2 films exhibited the unipolar and the bipolar switching behaviors in Pt/ZrO2/TiN MIM structure. The HRS resistance in unipolar switching behavior was reduced with increasing annealing temperature. On the contrary, The HRS resistance in bipolar switching behavior was increased. XPS showed the increase of metallic Zr in annealed ZrO2 films that could cause the reduction of HRS resistance in unipolar resistance switching of ZrO2. SIMS spectra confirmed the enlargement of interfacial TiOxNy layer in TiN bottom electrode with increasing the annealing temperature. The enlargement of interfacial TiOxNy layer was expected to cause an increase of HRS resistance because the larger amount of mobile oxygen ions in inter-facial TiOxNy layer was possible to migrate to ZrO2-x films.
Keywords :
X-ray diffraction; thin film resistors; titanium compounds; zirconium compounds; HRS resistance; Pt-ZrO2-TiN; XRD; ZrO2 films; annealing temperatures; bipolar switching; oxygen diffusion; resistance switching; resistive switching; unipolar switching; Annealing; Electrodes; Films; Resistance; Switches; Tin; Zirconium;
Conference_Titel :
Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International
Conference_Location :
Dresden
Print_ISBN :
978-1-4577-0503-8
DOI :
10.1109/IITC.2011.5940347