DocumentCode :
2010757
Title :
Piezoresistive CMOS sensor for the localized measurement of five independent stress components
Author :
Lemke, Benjamin ; Baskaran, Rajashree ; Paul, Oliver
Author_Institution :
Dept. of Microsyst. Eng. (IMTEK), Univ. of Freiburg, Freiburg, Germany
fYear :
2010
fDate :
24-28 Jan. 2010
Firstpage :
596
Lastpage :
599
Abstract :
This paper reports the development and characterization of a highly integrated polyvalent CMOS stress sensor detecting five linearly independent, temperature compensated components of the six-dimensional stress space. The sensor has a footprint of only 29×29 ¿m2. It combines different piezoresistance sensors to detect the three shear stresses, the in-plane normal stress difference, and a sum of the three normal stresses. The sensitivities of five sensing modes are characterized by applying in-plane normal and shear stresses, out-of-plane shear stresses, and temperature changes. The sensor performance is demonstrated by monitoring the hardening of an epoxy resin.
Keywords :
CMOS integrated circuits; piezoresistive devices; sensors; stress measurement; 6D stress space; epoxy resin; in-plane normal stress difference; out-of-plane shear stress; piezoresistive CMOS sensor; polyvalent CMOS stress sensor; CMOS process; Mechanical sensors; Monitoring; Optical sensors; Piezoresistance; Sensor phenomena and characterization; Silicon; Stress measurement; Temperature sensors; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
Conference_Location :
Wanchai, Hong Kong
ISSN :
1084-6999
Print_ISBN :
978-1-4244-5761-8
Electronic_ISBN :
1084-6999
Type :
conf
DOI :
10.1109/MEMSYS.2010.5442433
Filename :
5442433
Link To Document :
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