DocumentCode
2010817
Title
Thermoelectric behavior of microchannel plates fabricated by photo-assisted electrochemical etching
Author
Sun, Li ; Miao, Fengjuan ; Wang, Lianwei ; Chu, Paul K. ; Sarro, P.M.
Author_Institution
Dept. of Electron. Eng., East China Normal Univ., Shanghai, China
fYear
2010
fDate
24-28 Jan. 2010
Firstpage
576
Lastpage
579
Abstract
We demonstrate the favorable thermoelectric properties of silicon microchannel plates prepared by photo-assisted electrochemical etching (PAECE). The microchannels have a square lattice distribution. The lateral Seebeck coefficient is related to the orientation and is 186 ¿V/K along the edge of the square and 204 ¿V/K when the measurement is performed at 45° with respect to the edge. The Seebeck coefficient in the vertical direction is about one sixth of the lateral value. In order to investigate whether the photonic crystal properties of the silicon microchannels have any influence on the Seebeck coefficient, both microchannel plates with holes tilted 7° with respect to the vertical direction and ordinary silicon microchannel plates are tested. They exhibit a similar thermoelectric behavior. These values are comparable to the value of silicon nanowires at room temperature, making the use of microchannel plates a good alternative to nanowires for temperature sensors.
Keywords
Seebeck effect; elemental semiconductors; etching; micromechanical devices; photonic crystals; silicon; Si; lateral Seebeck coefficient; photoassisted electrochemical etching; photonic crystal properties; silicon microchannel plates; square lattice distribution; temperature sensors; thermoelectric behavior; Etching; Lattices; Microchannel; Nanowires; Performance evaluation; Photonic crystals; Silicon; Temperature sensors; Testing; Thermoelectricity;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
Conference_Location
Wanchai, Hong Kong
ISSN
1084-6999
Print_ISBN
978-1-4244-5761-8
Electronic_ISBN
1084-6999
Type
conf
DOI
10.1109/MEMSYS.2010.5442436
Filename
5442436
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