Nanowire filled polymer films for 3D system integration

Author

Graf, Matthias ; Meier, Karsten ; Haehnel, Veronika ; Schlörb, Heike ; Eychmüller, Alexander ; Wolter, Klaus-Jürgen

Author_Institution

Electron. Packaging Lab., Tech. Univ. Dresden, Dresden, Germany

fYear

2011

fDate

8-12 May 2011

Firstpage

1

Lastpage

3

Abstract

In the present paper, the use of high aspect ratio metallic nanowires (NWs) as functional interconnects between three-dimensionally stacked chips is proposed. First practical preparation steps, as there are the preparation of templates and the deposition of Ag-NWs, are presented. Later on, the applicational technology for vertically aligned NWs is proposed as their embedment into a polymer matrix resulting in an anisotropically conductive composite film. This is discussed in both technological and functional aspects.

Keywords

filled polymers; integrated circuit interconnections; nanofabrication; nanowires; polymer films; silver; three-dimensional integrated circuits; 3D system integration; Ag; anisotropically conductive composite film; nanowire filled polymer film; polymer matrix; ratio metallic nanowire; three-dimensionally stacked chip; Contacts; Electric potential; Films; Gold; Polymers; Three dimensional displays;

fLanguage

English

Publisher

ieee

Conference_Titel

Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International

Conference_Location

Dresden

ISSN

pending

Print_ISBN

978-1-4577-0503-8

Type

conf

DOI

10.1109/IITC.2011.5940356

Filename

5940356