Title :
A comparison of power supply planes in thick and thin film MCM´s
Author :
Lee, Keunmyung ; Barber, Alan
Author_Institution :
Hewlett-Packard Labs., Palo Alto, CA, USA
Abstract :
A method that would allow accurate modeling of arbitrarily shaped planes with bypass capacitors has been developed and verified with thick and thin film MCM substrates. The method is used to explore potential design choices for a large MCM with many simultaneously switching drivers
Keywords :
multichip modules; SPICE; arbitrarily shaped planes; bypass capacitors; circuit simulation; power supply planes; simultaneously switching drivers; thick film MCM; thin film MCM; time domain analysis; Circuit simulation; Circuit testing; Frequency; Impedance; Power supplies; SPICE; Scattering parameters; Substrates; Thick films; Transistors;
Conference_Titel :
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-2411-0
DOI :
10.1109/EPEP.1994.594038
