DocumentCode
2011068
Title
A comparison of power supply planes in thick and thin film MCM´s
Author
Lee, Keunmyung ; Barber, Alan
Author_Institution
Hewlett-Packard Labs., Palo Alto, CA, USA
fYear
1994
fDate
2-4 Nov 1994
Firstpage
3
Lastpage
6
Abstract
A method that would allow accurate modeling of arbitrarily shaped planes with bypass capacitors has been developed and verified with thick and thin film MCM substrates. The method is used to explore potential design choices for a large MCM with many simultaneously switching drivers
Keywords
multichip modules; SPICE; arbitrarily shaped planes; bypass capacitors; circuit simulation; power supply planes; simultaneously switching drivers; thick film MCM; thin film MCM; time domain analysis; Circuit simulation; Circuit testing; Frequency; Impedance; Power supplies; SPICE; Scattering parameters; Substrates; Thick films; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location
Monterey, CA
Print_ISBN
0-7803-2411-0
Type
conf
DOI
10.1109/EPEP.1994.594038
Filename
594038
Link To Document