ALD-enabled hermetic sealing for polymer-based wafer level packaging of MEMS

Author

Lin, Chingyi ; Zhang, Yadong ; Abdulagatov, Aziz ; Yang, Ronggui ; George, Steven ; Lee, Y.C.

Author_Institution

DARPA Center for Integrated Micro/Nano-Electromech. Transducers (iMINT), Univ. of Colorado, Boulder, CO, USA

fYear

2010

fDate

24-28 Jan. 2010

Firstpage

528

Lastpage

531

Abstract

Polymer-based packaging of micro electro mechanical systems (MEMS) can substantially reduce the processing temperature (>300Â°C), package size, and cost. In this paper, we demonstrated the feasibility of atomic layer deposition (ALD) enabled hermetic polymer packaging for MEMS applications using ALD on semi-polymer package and ALD on polymer package. We reported the hermeticity test results of ALD on semi-polymer package and a wafer-level packaging process developed for ALD on polymer package.

Keywords

atomic layer deposition; electronics packaging; micromechanical devices; ALD-enabled hermetic sealing; MEMS application; atomic layer deposition; hermetic polymer packaging; microelectro mechanical systems; polymer-based wafer level packaging; semipolymer package; Aluminum oxide; Costs; Marine vehicles; Micromechanical devices; Moisture; Packaging; Polymers; Temperature; Testing; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on

Conference_Location

Wanchai, Hong Kong

ISSN

1084-6999

Print_ISBN

978-1-4244-5761-8

Electronic_ISBN

1084-6999

Type

conf

DOI

10.1109/MEMSYS.2010.5442448

Filename

5442448