Title :
ALD-enabled hermetic sealing for polymer-based wafer level packaging of MEMS
Author :
Lin, Chingyi ; Zhang, Yadong ; Abdulagatov, Aziz ; Yang, Ronggui ; George, Steven ; Lee, Y.C.
Author_Institution :
DARPA Center for Integrated Micro/Nano-Electromech. Transducers (iMINT), Univ. of Colorado, Boulder, CO, USA
Abstract :
Polymer-based packaging of micro electro mechanical systems (MEMS) can substantially reduce the processing temperature (>300°C), package size, and cost. In this paper, we demonstrated the feasibility of atomic layer deposition (ALD) enabled hermetic polymer packaging for MEMS applications using ALD on semi-polymer package and ALD on polymer package. We reported the hermeticity test results of ALD on semi-polymer package and a wafer-level packaging process developed for ALD on polymer package.
Keywords :
atomic layer deposition; electronics packaging; micromechanical devices; ALD-enabled hermetic sealing; MEMS application; atomic layer deposition; hermetic polymer packaging; microelectro mechanical systems; polymer-based wafer level packaging; semipolymer package; Aluminum oxide; Costs; Marine vehicles; Micromechanical devices; Moisture; Packaging; Polymers; Temperature; Testing; Wafer scale integration;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
Conference_Location :
Wanchai, Hong Kong
Print_ISBN :
978-1-4244-5761-8
Electronic_ISBN :
1084-6999
DOI :
10.1109/MEMSYS.2010.5442448
