Title :
Drop-shock dynamic analysis of MEMS/package system
Author :
Yang, Chen ; Zhang, Bin ; Chen, Dajing ; Lin, Liwei
Author_Institution :
Univ. of California at Berkeley, Berkeley, CA, USA
Abstract :
This paper presents multi-scale analysis for a MEMS package system with experimental verifications to investigate dynamic responses under drop-shock tests. Dynamic responses such as acceleration waves of MEMS package in macro-scale are measured as the inputs of MEMS structures in micro-scale for numerical simulations. Structural deformation and stress distribution data are extracted and predicted. Possible applications include device fracture and in-operation stiction predictions for micro mechanical components in various MEMS sensors, including accelerometers and gyroscopes. We present results with MEMS accelerometers inside QFN packages.
Keywords :
accelerometers; electronics packaging; micromechanical devices; reliability; MEMS accelerometer; MEMS package system; MEMS sensor; QFN package; acceleration wave; drop-shock dynamic analysis; gyroscope; multiscale analysis; stress distribution; structural deformation; Acceleration; Accelerometers; Data mining; Gyroscopes; Mechanical sensors; Micromechanical devices; Numerical simulation; Packaging; Stress; System testing;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
Conference_Location :
Wanchai, Hong Kong
Print_ISBN :
978-1-4244-5761-8
Electronic_ISBN :
1084-6999
DOI :
10.1109/MEMSYS.2010.5442450
