Title :
Versatile vacuum packaging for experimental study of resonant MEMS
Author :
Schofield, Adam R. ; Trusov, Alexander A. ; Shkel, Andrei M.
Author_Institution :
Univ. of California, Irvine, CA, USA
Abstract :
This paper presents a versatile sub-mTorr vacuum packaging approach ideally suited for R&D of high performance dynamic MEMS. The procedure takes advantage of processing steps and materials used throughout the MEMS industry while providing maximum flexibility for changes in die size and layout. Prototypes of a new tuning fork gyroscope concept optimized to minimize substrate energy dissipation were packaged using the presented techniques and experimentally characterized to determine the sealed vacuum level. The combination of high-Q mechanical design with the packaging process resulted in a stable quality factor of greater than 91,000.
Keywords :
electronics packaging; micromechanical devices; resonance; vacuum techniques; MEMS industry; R&D; die layout; die size; high performance dynamic MEMS; high-Q mechanical design; resonant MEMS; sealed vacuum level; substrate energy dissipation; tuning fork gyroscope; versatile sub-mTorr vacuum packaging; Elementary particle vacuum; Energy dissipation; Gyroscopes; Micromechanical devices; Packaging; Prototypes; Q factor; Resonance; Vacuum technology; Vibrations;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
Conference_Location :
Wanchai, Hong Kong
Print_ISBN :
978-1-4244-5761-8
Electronic_ISBN :
1084-6999
DOI :
10.1109/MEMSYS.2010.5442453
