Title :
Fluidic self-assembly of millimeter scale thin parts on preprogrammed substrate at air-water interface
Author :
Park, Kwang Soon ; Xiong, Xugang ; Baskaran, Rajashree ; Böhringer, Karl F.
Author_Institution :
Dept. of Electr. Eng., Univ. of Washington, Seattle, WA, USA
Abstract :
This paper presents a novel method to achieve high yield assembly of millimeter-scale thin silicon chips from an air-water interface. Surface functionalized silicon parts (1000 × 1000 × 100 ¿m3) assemble in preprogrammed hydrophilic locations on a wafer substrate with self-alignment. We optimized the process and design factors systematically using DOE (Design of Experiment) that leads to high yield (100%).
Keywords :
design of experiments; microassembling; self-assembly; substrates; air-water interface; design of experiment; fluidic self-assembly; high yield assembly; millimeter scale thin parts; millimeter-scale thin silicon chips; preprogrammed hydrophilic location; preprogrammed substrate; surface functionalized silicon parts; wafer substrate; Acceleration; Assembly; Chromium; Containers; Electromagnetic forces; Electromagnetic measurements; Gold; Self-assembly; Silicon; Vibration measurement;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
Conference_Location :
Wanchai, Hong Kong
Print_ISBN :
978-1-4244-5761-8
Electronic_ISBN :
1084-6999
DOI :
10.1109/MEMSYS.2010.5442454
