Fluidic self-assembly of millimeter scale thin parts on preprogrammed substrate at air-water interface

Author

Park, Kwang Soon ; Xiong, Xugang ; Baskaran, Rajashree ; Böhringer, Karl F.

Author_Institution

Dept. of Electr. Eng., Univ. of Washington, Seattle, WA, USA

fYear

2010

fDate

24-28 Jan. 2010

Firstpage

504

Lastpage

507

Abstract

This paper presents a novel method to achieve high yield assembly of millimeter-scale thin silicon chips from an air-water interface. Surface functionalized silicon parts (1000 Ã— 1000 Ã— 100 Â¿m³) assemble in preprogrammed hydrophilic locations on a wafer substrate with self-alignment. We optimized the process and design factors systematically using DOE (Design of Experiment) that leads to high yield (100%).

Keywords

design of experiments; microassembling; self-assembly; substrates; air-water interface; design of experiment; fluidic self-assembly; high yield assembly; millimeter scale thin parts; millimeter-scale thin silicon chips; preprogrammed hydrophilic location; preprogrammed substrate; surface functionalized silicon parts; wafer substrate; Acceleration; Assembly; Chromium; Containers; Electromagnetic forces; Electromagnetic measurements; Gold; Self-assembly; Silicon; Vibration measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on

Conference_Location

Wanchai, Hong Kong

ISSN

1084-6999

Print_ISBN

978-1-4244-5761-8

Electronic_ISBN

1084-6999

Type

conf

DOI

10.1109/MEMSYS.2010.5442454

Filename

5442454