Title :
30-Gb/s optical and electrical test solution for high-volume testing
Author :
Watanabe, Daisuke ; Masuda, Shin ; Hara, Hideki ; Ataka, Tsuyoshi ; Seki, Atsushi ; Ono, Atsushi ; Okayasu, Toshiyuki
Author_Institution :
ADVANTEST Corp., Maebashi, Japan
Abstract :
To enable high-volume testing of LSIs with high-speed optical and electrical interfaces, we developed a proof-of-concept device of an optical LSI test system for use in mass-production testing. Key technologies include high-density and high-performance optical functional devices and a device interface enabling simultaneous connection of optical and electrical interfaces. Our proposed system, using PLZT thin-film modulators, supports multi-channel optical bit-error-rate (BER) testing of devices with signal rates up to 30 Gb/s with results that correlate reasonably well with those measured by conventional BER test system (BERTs). Moreover, our newly developed opto-electronic hybrid interface socket enables high-volume testing with good insertion losses and repeatability. Additionally, our flexible system architecture can be used for testing at various laser wavelengths and with various parameters for optical LSIs in combination with off-the-shelf instruments for meeting optical characterization requirements.
Keywords :
error statistics; flexible electronics; high-speed integrated circuits; integrated circuit testing; integrated optoelectronics; large scale integration; modulators; optical testing; PLZT; PLZT thin-film modulators; bit-error-rate; flexible system architecture; high-speed electrical interfaces; high-speed optical interfaces; high-volume testing; insertion losses; mass-production testing; multichannel optical BER testing; off-the-shelf instruments; optical LSI test system; optical characterization requirements; optical-electrical test solution; opto-electronic hybrid interface socket; proof-of-concept device; Adaptive optics; High-speed optical techniques; Integrated optics; Optical fibers; Optical sensors;
Conference_Titel :
Test Conference (ITC), 2013 IEEE International
Conference_Location :
Anaheim, CA
DOI :
10.1109/TEST.2013.6651887