DocumentCode
2011344
Title
Test-yield improvement of high-density probing technology using optimized metal backer with plastic patch
Author
Sen-Kuei Hsu ; Hao Chen ; Chung-Han Huang ; Der-Jiann Liu ; Wei-Hsun Lin ; Hung-Chih Lin ; Ching-Nen Peng ; Min-Jer Wang
Author_Institution
Taiwan Semicond. Manuf. Co., Ltd., Hsinchu, Taiwan
fYear
2013
fDate
6-13 Sept. 2013
Firstpage
1
Lastpage
10
Abstract
High-density probing is a main trend of the test technology. The warping issues of probe card are caused by the high-density test. The metal backer and patches are applied to solve this problem and the optimized sizes of backer and patches are decided by the proposed flow. Using the probe card with optimized backer and patches, the stability of test can be ensured and the test yields are increased. 26.56% test-yield improvement can be obtained.
Keywords
automatic testing; integrated circuit testing; integrated circuit yield; high-density probing technology; high-density test; metal backer; patches; probe card warping; test technology; test-yield improvement; Analytical models; Force; Metals; Pins; Probes; Stress; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference (ITC), 2013 IEEE International
Conference_Location
Anaheim, CA
ISSN
1089-3539
Type
conf
DOI
10.1109/TEST.2013.6651888
Filename
6651888
Link To Document