Title :
Test-yield improvement of high-density probing technology using optimized metal backer with plastic patch
Author :
Sen-Kuei Hsu ; Hao Chen ; Chung-Han Huang ; Der-Jiann Liu ; Wei-Hsun Lin ; Hung-Chih Lin ; Ching-Nen Peng ; Min-Jer Wang
Author_Institution :
Taiwan Semicond. Manuf. Co., Ltd., Hsinchu, Taiwan
Abstract :
High-density probing is a main trend of the test technology. The warping issues of probe card are caused by the high-density test. The metal backer and patches are applied to solve this problem and the optimized sizes of backer and patches are decided by the proposed flow. Using the probe card with optimized backer and patches, the stability of test can be ensured and the test yields are increased. 26.56% test-yield improvement can be obtained.
Keywords :
automatic testing; integrated circuit testing; integrated circuit yield; high-density probing technology; high-density test; metal backer; patches; probe card warping; test technology; test-yield improvement; Analytical models; Force; Metals; Pins; Probes; Stress; Substrates;
Conference_Titel :
Test Conference (ITC), 2013 IEEE International
Conference_Location :
Anaheim, CA
DOI :
10.1109/TEST.2013.6651888
