Title :
RF MEMS switches for Wide I/O data bus applications
Author :
Cohn, Michael B. ; Saechao, Kaosio ; Whitlock, Michael ; Brenman, Daniel ; Tang, Wallace T. ; Proie, Robert M.
Author_Institution :
MicroAssembly Technol. Inc., Richmond, CA, USA
Abstract :
Wide I/O poses serious challenges due to the requisite high density of electronics and relays near the DUT, as well as high bandwidth. A 2×2mm MEMS switch has been demonstrated, offering >80% footprint reduction relative to a typical TO-can electromagnetic relay. A further benefit of its small size, the MEMS relay is able to operate up to Ka-band (40 GHz) with hot switch capability and repeatability of <;±50mΩ. To our knowledge, our latest SPDT device holds the current record in power handling for MEMS devices of 24 W at 10 million cycles.
Keywords :
microrelays; system buses; DUT; RF MEMS switches; SPDT device; TO-can electromagnetic relay; footprint reduction; hot switch capability; hot switch repeatability; power 24 W; power handling; wide I-O data bus applications; Contacts; Micromechanical devices; Microswitches; Radio frequency; Relays; Substrates; ATE; MEMS Switch; Relay; Switch Matrix; TSV; Wide I/O;
Conference_Titel :
Test Conference (ITC), 2013 IEEE International
Conference_Location :
Anaheim, CA
DOI :
10.1109/TEST.2013.6651889
