• DocumentCode
    2011380
  • Title

    Thermal management of vertical gallium nitride nanowire arrays: Cooling design and tip temperature measurement

  • Author

    Cheng, Jen-Hau ; Seghete, Dragos ; George, Steven M. ; Yang, Ronggui ; Lee, Y.C.

  • Author_Institution
    Univ. of Colorado at Boulder, Boulder, CO, USA
  • fYear
    2010
  • fDate
    24-28 Jan. 2010
  • Firstpage
    468
  • Lastpage
    471
  • Abstract
    This study reports a new thermal management scheme for vertical Gallium Nitride (GaN) nanowire (NW) arrays. A new cooling design for vertical NWs is developed by encapsulating NWs with electroplated copper. Numerical simulations show that the thermal performance of NW array could be significantly enhanced when encapsulated with high thermal conductivity materials. We have also developed a tip temperature measurement technique to characterize the tip temperature of vertical GaN NWs by using steady-state photoluminescence (PL) system. The cooling design and tip temperature measurement technique can be applied to various NW-based nanoelectronic and nanophotonic applications.
  • Keywords
    III-V semiconductors; electroplated coatings; gallium compounds; nanowires; temperature measurement; thermal analysis; thermal conductivity; thermal management (packaging); GaN; NW-based nanoelectronic; cooling design; electroplated copper; nanophotonic applications; numerical simulation; steady-state photoluminescence system; thermal conductivity materials; thermal management; tip temperature measurement; vertical NW array design; vertical nanowire arrays; Conducting materials; Cooling; Copper; Gallium nitride; III-V semiconductor materials; Numerical simulation; Steady-state; Temperature measurement; Thermal conductivity; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
  • Conference_Location
    Wanchai, Hong Kong
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-5761-8
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2010.5442465
  • Filename
    5442465