DocumentCode
2011395
Title
Titanium nitride sidewall stringer process for lateral nanoelectromechanical relays
Author
Lee, D. ; Lee, W.S. ; Provine, J. ; Lee, J.-O. ; Yoon, J.-B. ; Howe, R.T. ; Mitra, S. ; Wong, H.-S.P.
Author_Institution
Stanford Univ., Stanford, CA, USA
fYear
2010
fDate
24-28 Jan. 2010
Firstpage
456
Lastpage
459
Abstract
This paper reports on lateral nanoelectromechanical (NEM) relays based on variations of a two- or three-mask titanium nitride (TiN) sidewall stringer process. Electrically isolated TiN perimeter beams are fabricated from stringers formed on the inside walls of polysilicon trenches, yielding 200 nm wide TiN fins and 200 nm gaps; these dimensions are 3X smaller than the resolution limit of the optical lithography tool (600 nm) utilized. The reduction in the operating voltage is about a factor of 5 compared to 600 nm wide polysilicon beams. Simple scaling could potentially enable sub-1V operation. Five-terminal NEM relays demonstrate successful switching in both directions over 1000 DC-sweep cycles with low drain bias (100 mV).
Keywords
nanoelectromechanical devices; titanium compounds; TiN; five-terminal NEM relays; lateral nanoelectromechanical relays; optical lithography tool; polysilicon trenches; sidewall stringer process; size 200 nm; size 600 nm; voltage 100 mV; Contacts; Electrodes; Fabrication; Lithography; Micromechanical devices; Relays; Switches; Tin; Titanium; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
Conference_Location
Wanchai, Hong Kong
ISSN
1084-6999
Print_ISBN
978-1-4244-5761-8
Electronic_ISBN
1084-6999
Type
conf
DOI
10.1109/MEMSYS.2010.5442466
Filename
5442466
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