• DocumentCode
    2011423
  • Title

    Electrical Resistivity and Seebeck Coefficient of Segmented Thermoelements

  • Author

    Sharp, J. ; Gilbert, P. ; Thompson, A.

  • Author_Institution
    Marlow Industries, Inc., Dallas, TX
  • fYear
    2006
  • fDate
    6-10 Aug. 2006
  • Firstpage
    29
  • Lastpage
    32
  • Abstract
    To enhance efficiency while maintaining device simplicity, wafers of different thermoelectric materials are sometimes joined to form segmented thermoelements. Properly designed segmented thermoelements provide a high average ZT by matching materials to the temperature profile along the thermoelement length. One possible penalty of segmentation is reduction of ZT by interfacial effects, such as contact resistance or reaction zones. Interfacial effects will become increasingly important as the wafers are made thinner, but thinner wafers are more economical. We are making segmented thermoelements for an U.S. Department of Energy waste heat recovery program. The thermoelements contain one to three segments of common power generation materials, and they are 0.5 to 2 mm thick. Here we present measurements of the electrical resistivity and Seebeck coefficient of PbTe and n-type Bi2Te3 alloy samples designed to highlight interfacial effects. For 1 mm thick wafers, we do not see significant contact resistance. There is insufficient data at this point to assess if the effective Seebeck coefficient is thickness-dependent
  • Keywords
    Seebeck effect; bismuth alloys; contact resistance; electrical resistivity; lead alloys; tellurium alloys; waste heat; waste recovery; 0.5 to 2 mm; Bi2Te3; PbTe; Seebeck coefficient; U.S. Department of Energy; contact resistance; electrical resistivity; interfacial effects; power generation materials; segmented thermoelements; thermoelectric materials; waste heat recovery program; Contact resistance; Electric resistance; Heat recovery; Joining materials; Power generation economics; Power system economics; Temperature; Thermoelectric devices; Thermoelectricity; Waste heat;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2006. ICT '06. 25th International Conference on
  • Conference_Location
    Vienna
  • ISSN
    1094-2734
  • Print_ISBN
    1-4244-0811-3
  • Electronic_ISBN
    1094-2734
  • Type

    conf

  • DOI
    10.1109/ICT.2006.331262
  • Filename
    4133228