• DocumentCode
    2011541
  • Title

    The characteristics of magnetically enhanced large area processing plasmas

  • Author

    Cho, B.U. ; Park, S.E. ; Lee, Jung Keun ; Lee, Y.J. ; Yeom, G.Y.

  • Author_Institution
    Dept. of Electron. & Electr. Eng., Pohang Univ. of Sci. & Technol., South Korea
  • fYear
    2003
  • fDate
    5-5 June 2003
  • Firstpage
    161
  • Abstract
    Summary form only given, as follows. In order to improve production efficiency, large-diameter wafer substrates (300mm diameter) and large-area glass substrates(from 0.4 to 1 m/sup 2/) have been adopted recently. With the increased reactor size, the high density and good uniformity become more important. Generally, magnetically enhanced inductively coupled plasmas (MICP) have a higher plasma density for a given power deposition than ICP sources due to their high ionization efficiency and the increased power absorbing efficiency. To investigate the discharge phenomenon in the chamber that consists of embedded antenna coil in the rectangular system (1,020mm /spl times/ 830mm /spl times/ 437mm) with permanent magnetic arrays, we have developed a magnetized two-dimensional (2-D) fluid simulation model. We have used the Poisson Superfish to obtain 2-D realistic magnetic field. Depending on process conditions and the arrangement of magnets, the distribution of plasma parameters have many differences. The parameters, which affect non-uniformity, electron temperature, and others, can be explained in a manner similar to the inductively coupled plasma source with a cylindrical chamber. Our simulation results show that the high density and good uniformity plasma can be obtained in the embedded antenna coil system with a suitable magnetic arrangement. It is compared with the experiment.
  • Keywords
    Poisson equation; plasma density; plasma materials processing; plasma simulation; plasma sources; plasma temperature; 2-D realistic magnetic field; Poisson Superfish; discharge phenomenon; electron temperature; embedded antenna coil; inductively coupled plasmas; large area processing plasmas; large-area glass substrates; large-diameter wafer substrates; magnetically enhanced plasmas; permanent magnetic arrays; plasma nonuniformity; power absorbing efficiency; production efficiency; two-dimensional fluid simulation model; Coils; Glass; Inductors; Plasma density; Plasma materials processing; Plasma properties; Plasma simulation; Plasma sources; Plasma temperature; Production;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Science, 2003. ICOPS 2003. IEEE Conference Record - Abstracts. The 30th International Conference on
  • Conference_Location
    Jeju, South Korea
  • ISSN
    0730-9244
  • Print_ISBN
    0-7803-7911-X
  • Type

    conf

  • DOI
    10.1109/PLASMA.2003.1228607
  • Filename
    1228607