DocumentCode :
2011618
Title :
Ion-acoustic waves in a complex plasma with negative ions
Author :
Vladimirov, S.V. ; Ostrikov, K. ; Yu, Martin Yuecheng ; Morfill, Gregor E.
Author_Institution :
Sch. of Phys., Sydney Univ., NSW, Australia
fYear :
2003
fDate :
5-5 June 2003
Firstpage :
163
Abstract :
Summary form only given, as follows. A self-consistent theory of linear waves in complex laboratory plasmas containing dust grains and negative ions is presented. A comprehensive model for such plasmas including source and sink effects associated with the presence of dust grains and negative ions is introduced. The stationary state of the plasma as well as the dispersion and damping characteristics of the waves are investigated. All relevant processes, such as ionization, diffusion, electron attachment, negative-positive ion recombination, dust charge relaxation, and dissipation due to electron and ion elastic collisions with neutrals and dust particles, as well as charging collisions with the dusts, are taken into consideration.
Keywords :
damping; dusty plasmas; electron attachment; ion recombination; negative ions; plasma collision processes; plasma ion acoustic waves; charging collisions; collective processes; complex plasma; damping characteristics; diffusion; dispersion characteristics; dust charge relaxation; dust grains; electron attachment; electron collisions; ion elastic collisions; ion-acoustic waves; ionization; linear waves; negative ions; negative-positive ion recombination; self-consistent theory; sink effects; source effects; stationary state; Damping; Dusty plasma; Electrons; Ionization; Laboratories; Plasma properties; Plasma sources; Plasma waves; Spontaneous emission; Stationary state;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Plasma Science, 2003. ICOPS 2003. IEEE Conference Record - Abstracts. The 30th International Conference on
Conference_Location :
Jeju, South Korea
ISSN :
0730-9244
Print_ISBN :
0-7803-7911-X
Type :
conf
DOI :
10.1109/PLASMA.2003.1228612
Filename :
1228612
Link To Document :
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